HomeTechnologyComputingLITEON Showcase Strength in Total Solution for High Performance Computing at SC22...

LITEON Showcase Strength in Total Solution for High Performance Computing at SC22 in Dallas Texas

DALLAS, November 18, 2022 /PRNewswire/ — LITEON Technology, the world’s leading provider of power, mechanical and cooling solutions, on display at booth 327 in SC22 Summit at November 14-17, 2022at the Kay Bailey Hutchison Convention Center, Dallas, Texas. With the record attendance and collected request, SC22 has been a great success for us, following a successful OCP 2022 show in San Jose last month.

LITEON’s focus and innovation is demonstrated through our broad portfolio of product coverage and solutions supporting Hyperconverged Infrastructure (HCI) solutions, and High Performance Computing (HPC), which go above and beyond Open Rack products for rack enclosures (19″-21 “) for both 12V and 48V architecture, power and battery backup (3KW-5.5KW) and Power Shelf (15KW-27.5KW) through ODM and OEM partnerships that integrate their technologies into their systems with the highest performance and the most competitive cost. For High Performance computing, we have developed an industry-leading power solution, exceeding 100W/in3, in multiple standard form factors with included MCRPS 3200W, targeting next generation HPC and Machine Learning & Artificial Intelligence applications.

We will also present a liquid cooling solution. Due to the increasing demand for high-performance computers, artificial intelligence and machine railing, the demand for energy budgets has increased significantly. Traditional convection-cooled solutions will not be enough to dissipate such high heat, so liquid cooling will be the next mainstream solution for rack-optimized and data center applications. Leveraging our strengths in mechanical design, power system solution and thermal management, coupled with our leadership in hardware and software design, LITEON developed a total liquid cooling system solution to enable rack-level Hyper-Converged Infrastructure (HCI). including OCP V3 enabled Rack, server chassis, power system and battery backup solution, as well as CDU and liquid cooling peripherals, to support our customer in easy deployment in data center applications.

In addition to these solutions, we also present our server enclosures. LITEON Technology has over 25 years of experience in chassis product design, in-house tooling development and manufacturing. We also have a dedicated CAE team to perform simulation analysis in the early stages of new product development, enhancing the design robustness and cost competitiveness of our solution. From our experienced chassis product design and highly efficient automation manufacturing, we continue to expand our footprint to cloud applications, expecting broad coverage/total mechanical solution for our customers.

Over the past two years, LITEON has increased our global manufacturing footprint in several locations Asia. In 2023 we will further expand our manufacturing footprint Asia until North America region in Plano Dallas, as well Guadalajara Mexico. With this step we wanted to bring the supply closer to the demand, improve our flexibility and shorten the lead time North America market.

At SC22, LITEON Technology showcased our latest Open Rack compatible power products as below:

1- 50V ATS-PSU Power Shelf System, 2OU, 33kW, N+1

2- 50V ORV3 Battery Backup System, 2OU, 15kW @240Sec, N+1

3- 50V ORV3 Power Shelf System, 1OU, 15kW, N+1

4- 50V ORV3 Compatible Immersion Power Shelf System, 2OU, 24kW, N+1

5- 12V ATS-PSU power supply with backup system, 3OU, [email protected]N+1

6- 12V horizontal power system, 2OU, 24kW, N+1

7- 12V vertical submersible power supply system, 3OU, 27kW, N+1

8- 12V battery backup system, 1OU, [email protected]

9- MCRPS 3200W power module

SOURCE LITEON technology

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